Product Development

Introducing ANSYS 17.0 – 10X Productivity, Insights and Performance

2 February 2016 | Team EACPDS


[About the author: Walid Abu-Hadba is the Chief Product Officer at ANSYS and is responsible for providing leadership for the overall strategy and management of the activities within ANSYS’ technical business units, including integration, development, research and patents.]
ANSYS 17.0 | EACPDSWith a number of emerging technologies and trends on the horizon, it is an exciting but challenging time to be an engineer. The convergence of new technologies into Industry 4.0 is ushering in an era of unbound product innovation. With the advent of the Internet of Things, a tighter integration of the digital world and the world of machines will profoundly transform consumer and industrial markets. New advanced materials are enabling engineers to create substantially lighter and sustainable designs. New technologies are changing the way we harvest, store, and use energy. And the possibilities of virtual reality and additive manufacturing are freeing engineers to explore more radical designs, free of manufacturing constraints. Make no mistake, engineering simulation will be the key to unlocking the power and potential of this new industrial revolution, and to this end, I am excited and honored to announce the next release of our simulation platform on behalf of over a thousand R&D professionals at ANSYS.

10X-ANSYS-17 | EACPDSANSYS 17.0 delivers the most comprehensive set of physics features that ANSYS has released in their 45-year history. It provides engineering simulation solutions teams across all disciplines, including structures, fluids, electronics, embedded software and systems engineering. Beyond just adding features, ANSYS improved performance by a full order of magnitude, giving you 10x the productivity, 10x greater insight into your product design and 10x the performance to design and innovate more quickly and efficiently than ever.

Increasing Your Productivity by 10x with ANSYS 17

ANSYS 17.0 delivers solutions faster so that you can make better design decisions earlier in the product development cycle. ANSYS made improvements across the entire workflow, from modeling to post processing, radically accelerating results without compromising accuracy. In the fluids product line, you’ll notice a dramatic improvement in usability and interactivity. New ribbon-style toolbars and other improvements make navigation more intuitive, faster, and reduces the number of mouse clicks necessary to perform a task. If you’re new to our software, you can jump in and become productive quickly. If you’re more experienced, you’ll find new tools and options that expand your analysis capabilities.


ANSYS also expanded our SCADE model-based, embedded software development and simulation environment. ANSYS 17.0 enables software engineers to be more productive with developing, testing and certifying embedded software. New industry-specific vertical solutions take full benefit from the openness and flexibility of the platform to facilitate OEM-supplier interactions while adhering to such industry standards, such as ARINC 664/653, FACE and AUTOSAR.

ANSYS 17.0 | EACPDSThe chip-package-system design workflow for electronics is more tightly integrated and automated, and now includes across-the-board performance improvements for power integrity, signal integrity and EMI analyses. High performance computing (HPC) improvements over the past two releases give you 20-60x performance gains for package and board simulation. In addition, a thermal analysis in now integrated and automated in ANSYS SIWave. Package engineers no longer need to use (or learn) a separate electronics cooling application – they can get robust and accurate thermal results in less than two minutes with just a few mouse clicks, a productivity improvement of over 100x!

ANSYS 17 — 10x Greater Insight

An increasingly rich suite of models and better post-processing gives engineering teams greater insight into their designs and real-world performance of their products.

Mechanical Engineers can now accurately model the multitude of layers and traces in a printed circuit board, a task that was previously impractical due to the size and complexity of the meshing. With ANSYS 17, ECAD geometry can now be directly imported along with the metal trace data, to create a mesh with lower element counts to predict stress, deformation and fatigue caused by high power densities. These capabilities enable you to design PCB layouts and thermal management strategies for more reliable electronic components.

System-level simulations involving mechanical and fluidic system have also advanced in ANSYS 17.0. In this release, we have introduced native support for the industry-standard system modeling language, Modelica®. This language gives you access to hundreds of additional mechanical and fluid component models in addition to the rich library for power electronics models already provided by our software. At the same time, advancements in the platform enable system engineers to more easily incorporate high-fidelity 3-D results into system-level models to verify that detailed component changes meet system-level requirements.

ANSYS 17 — 10x the Performance

Of course, ANSYS continues to maintain its leadership in parallel performance. Our high performance computing (HPC) architecture leverages the latest processor technologies. Simulations that once took weeks of computational time can now be solved in days or even hours. HPC for the structures suite has benefited from a number of performance advancements and can now address highly complex models with scaling up to 1,000 cores. By adding an HPC Workpack, structural analysts can increase their simulation throughput by 10x, and it doesn’t require a massive investment in hardware either– this power can be harnessed on most IT configurations, from desktops to cloud environments. Meanwhile, ANSYS Fluent smashed the previous world record by scaling up to 129,000 cores at 90 percent efficiency.

ansys-fluent-hpc-max-cores | EACPDS

We are also very excited about the HPC advancements for full transient electromagnetic field simulation. A new, patent pending Time Decomposition Method speeds up analysis by more than just 10x. In one case, runtime was reduced from 270 hours to just twelve. Now you can efficiently analyze transient motor behavior, like start-up and dynamic loading, during earlier design phases of your product design.

Given the evolution – or rather revolution – of the emerging trends mentioned earlier, the pressure on product development teams will not be easing any time soon. To meet the exciting challenges ahead – expanding into connected devices, designing more energy efficient products, ensuring the safety of autonomous systems, verifying radically new structural designs and advanced materials – you’ll need a strategy that includes simulation. ANSYS 17.0 gives you the best simulation tools available to lead your organization into the next industrial revolution.

I’ve only touched the surface of the improvements and innovations included in this release. To learn more about ANSYS 17.0, please contact EAC to request a demonstration or product literature. I’m sure you will be as excited as we are.

[This article was originally published to the ANSYS Blog on January 27, 2016]